PCB/PCBA Failure Analysis
Basic Introduction
With the high density of electronic products and the lead-free electronic manufacturing, the technical level and quality requirements of PCB and PCBA products are also facing severe challenges. The design, production, processing and assembly of PCB require more stringent control of processes and raw materials. At present, due to the transition period of technology and process, customers still have great differences in their understanding of PCB process and assembly. Therefore, failures such as leakage, open circuit (line, hole), poor welding, and board explosion often occur, which often cause quality responsibility disputes between suppliers and users, resulting in serious economic losses. Through failure analysis of PCB and PCBA failure phenomena, through a series of analysis and verification, find out the cause of failure, explore the failure mechanism, which is of great significance to improve product quality, improve production process, and arbitrate failure accidents.
Service Object
Printed circuit boards and their components (PCB&PCBA) are the core components of electronic products. The reliability of PCB&PCBA directly determines the reliability of electronic products. In order to ensure and improve the quality and reliability of electronic products, a comprehensive physical and chemical analysis of failures is carried out to confirm the internal mechanism of failure, so as to propose targeted improvement measures.
LCS has profound board-level failure analysis technical capabilities, complete failure analysis methods, a large analysis case database and an expert team to provide you with high-quality and fast failure analysis services.
Significance of failure analysis
1. Help manufacturers understand product quality status, analyze and evaluate the current process status, and optimize and improve product development plans and production processes;
2. Find out the root cause of failure in electronic assembly, provide effective electronic assembly on-site process improvement solutions, and reduce production costs;
3. Improve product qualification rate and reliability, reduce maintenance costs, and enhance corporate brand competitiveness;
4. Clarify the responsible party for product failure and provide a basis for judicial arbitration.
Analyzed PCB/PCBA types
Rigid printed circuit board, flexible printed circuit board, rigid-flexible board, metal substrate
Communication PCBA, lighting PCBA
Common failure analysis techniques
Composition analysis:
Micro-FTIR
Scanning electron microscope and energy spectrum analysis (SEM/EDS)
Auger electron spectroscopy (AES)
Time-of-flight secondary ion mass spectrometer (TOF-SIMS)
Thermal analysis techniques:
Differential scanning calorimetry (DSC)
Thermomechanical analysis (TMA)
Thermogravimetric analysis (TGA) )
Dynamic Thermomechanical Analysis (DMA)
Thermal conductivity (steady-state heat flow method, laser flash method)

Ion cleanliness test:
NaCl equivalent method
Cation and anion concentration test

Stress strain measurement and analysis:
Thermal deformation test (laser method)
Stress strain gauge (physical bonding method)

Destructive testing:
Metallographic analysis
Dyeing and penetration testing
Focused ion beam analysis (FIB)
Ion milling (CP)

Nondestructive analysis technology:
X-ray nondestructive analysis
Electrical performance test and analysis
Scanning acoustic microscopy (C-SAM)
Hotspot detection and positioning