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Slice analysis

Slice analysis

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Product Description

Slice analysis
Introduction to slice analysis
Slice analysis technology is one of the most common and important analysis methods in the manufacturing industries such as PCB/PCBA and parts. It is usually used for quality judgment and quality abnormality analysis, inspection of circuit board quality, PCBA welding quality inspection, finding causes and solutions for failure, and evaluating process improvements as a basis for objective inspection, research and judgment.

Slice analysis

Test purpose
Slice analysis is usually used for quality judgment and quality abnormality analysis, inspection of circuit board quality, PCBA welding quality inspection, finding causes and solutions for failure, and evaluating process improvements as a basis for objective inspection, research and judgment.
Applicable product range
Slice analysis is applicable to metal materials, polymer materials, ceramic products, automotive parts and accessories manufacturing, electronic devices, PCB/PCBA products and industries.
Main equipment and consumables
SEM/EDS, 3D digital optical microscope, stereo microscope, grinding/polishing machine, precision cutting machine, grinding sandpaper, polishing cloth/polishing liquid, epoxy resin glue + curing agent.
Method and steps
Cutting and sampling-placing samples-stirring and adjusting glue-filling samples-vacuuming-waiting for solidification-grinding and polishing-finished product observation

Slice analysis method and steps

Test application
Material application: metal/polymer products

Material slice analysis

When customers need to observe the internal structure and defect analysis, coating/plating process analysis, and internal component analysis (EDS) of samples, they can use the slice analysis method to observe the internal structure, coating/plating process analysis, and verify the suspected abnormal cracking, voids and other defects found in the samples. Electronic product application: electronic device products

Electronic product slice analysis

With the development of science and technology and the advancement of technology, electronic products are becoming more and more miniaturized, complex and systematic, while their functions are becoming more and more powerful, the integration is getting higher and higher, and the volume is getting smaller and smaller. We can use slice analysis to confirm the failure phenomenon of electronic components and analyze the defects of processes and raw materials. Micro slices obtained by microsectioning technology can be used for structural analysis of electronic components, inspection of electronic component surfaces and internal defect inspection. PCB/PCBA product application: PCB/PCBA products

PCB slice analysis

Through slice analysis, quality judgment and preliminary analysis of the causes of defects are made and multiple properties of printed circuit boards are tested. For example: plating cracks, hole wall delamination, solder coating conditions, interlayer thickness, plating thickness in holes, through-hole aperture size, through-hole quality observation, hole wall roughness, etc. It is used to check the internal voids of PCBA solder joints, welding bonding conditions, wetting quality evaluation, etc.

Products Details

Home > Products >
Certification
>
Slice analysis

Slice analysis

Detail Information
Product Description

Slice analysis
Introduction to slice analysis
Slice analysis technology is one of the most common and important analysis methods in the manufacturing industries such as PCB/PCBA and parts. It is usually used for quality judgment and quality abnormality analysis, inspection of circuit board quality, PCBA welding quality inspection, finding causes and solutions for failure, and evaluating process improvements as a basis for objective inspection, research and judgment.

Slice analysis

Test purpose
Slice analysis is usually used for quality judgment and quality abnormality analysis, inspection of circuit board quality, PCBA welding quality inspection, finding causes and solutions for failure, and evaluating process improvements as a basis for objective inspection, research and judgment.
Applicable product range
Slice analysis is applicable to metal materials, polymer materials, ceramic products, automotive parts and accessories manufacturing, electronic devices, PCB/PCBA products and industries.
Main equipment and consumables
SEM/EDS, 3D digital optical microscope, stereo microscope, grinding/polishing machine, precision cutting machine, grinding sandpaper, polishing cloth/polishing liquid, epoxy resin glue + curing agent.
Method and steps
Cutting and sampling-placing samples-stirring and adjusting glue-filling samples-vacuuming-waiting for solidification-grinding and polishing-finished product observation

Slice analysis method and steps

Test application
Material application: metal/polymer products

Material slice analysis

When customers need to observe the internal structure and defect analysis, coating/plating process analysis, and internal component analysis (EDS) of samples, they can use the slice analysis method to observe the internal structure, coating/plating process analysis, and verify the suspected abnormal cracking, voids and other defects found in the samples. Electronic product application: electronic device products

Electronic product slice analysis

With the development of science and technology and the advancement of technology, electronic products are becoming more and more miniaturized, complex and systematic, while their functions are becoming more and more powerful, the integration is getting higher and higher, and the volume is getting smaller and smaller. We can use slice analysis to confirm the failure phenomenon of electronic components and analyze the defects of processes and raw materials. Micro slices obtained by microsectioning technology can be used for structural analysis of electronic components, inspection of electronic component surfaces and internal defect inspection. PCB/PCBA product application: PCB/PCBA products

PCB slice analysis

Through slice analysis, quality judgment and preliminary analysis of the causes of defects are made and multiple properties of printed circuit boards are tested. For example: plating cracks, hole wall delamination, solder coating conditions, interlayer thickness, plating thickness in holes, through-hole aperture size, through-hole quality observation, hole wall roughness, etc. It is used to check the internal voids of PCBA solder joints, welding bonding conditions, wetting quality evaluation, etc.